Practical Components
dummy components, tools and kits
SBGA
SuperBGA®
Ball Grid Array
- CVBGA Very Thin Chip Array® BGA —Amkor
- CABGA Chip Array® BGA —Amkor
- TapeArray® BGA—Amkor
- CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array —Amkor
- PBGA Plastic Ball Grid Array Pitch
- SuperBGA®—Amkor
SuperBGA® (SBGA) package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heatsink. Since the IC and the I/O are on the same side, signal vias are eliminated.
Quick Link to: Cross Section Drawing and Solder Information
| SuperBGA® (1.27mm Pitch) | ||||||
|---|---|---|---|---|---|---|
| Part Number | I/O Count |
Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Qty Per Tray |
| A-SBGA256-1.27mm-27mm | 256 | 1.27mm | 27mm | 20 x 20 | Perimeter | 40 |
| A-SBGA304-1.27mm-31mm | 304 | 1.27mm | 31mm | 23 x 23 | Perimeter | 27 |
| A-SBGA352-1.27mm-35mm | 352 | 1.27mm | 35mm | 26 x 26 | Perimeter | 24 |
| A-SBGA432-1.27mm-40mm | 432 | 1.27mm | 40mm | 31 x 31 | Perimeter | 21 |
| A-SBGA520-1.27mm-40mm | 520 | 1.27mm | 40mm | 31 x 31 | Perimeter | 21 |
| A-SBGA560-1.27mm-42.5mm | 560 | 1.27mm | 42.5mm | 33 x 33 | Perimeter | 12 |
| A-SBGA600-1.27mm-45mm | 600 | 1.27mm | 45mm | 35 x 35 | Perimeter | 12 |
- Superior thermal performance.
- Light weight
- Low profile (1.4mm mounted)
- Moisture resistant (JEDEC level 3)
- JEDEC MO-192 standard outlines
- Enhanced electrical performance > 1 GHz
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.
- Parts can be baked and dry-packed.
- All components are daisy-chained except for 520 I/O.
- Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 5% Cu alloy.
