Practical Components

Plastic Ball Grid Array

Ball Grid Array

• CVBGA Very Thin Chip Array® BGA —Amkor
• CABGA Chip Array® BGA —Amkor
• TapeArray® BGA—Amkor
• CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
• PBGA Plastic Ball Grid Array —Amkor
• PBGA Plastic Ball Grid Array Pitch
• SuperBGA®—Amkor

• Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).
• Parts are packaged in JEDEC trays.
• Call for tape and reel quantity and availability.
• Solder ball material is eutectic 63/37 SnPb.
• All components are daisy-chained.
• Daisy-chained connections are connections between I/O (input/output) of the component.
• BT (Bismaleimide-Triazine) substrates.
• JEDEC MS-034 standard outlines.
• Ball diameter varies (see chart).
• BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.
• Moisture sensitivity is JEDEC level 3.
• Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
• Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also available.
• Sn3.5Ag also available (call for availability).
• PBGA's are not available without solder balls.

• * = DC available
• Parts are packaged in JEDEC trays.
• Call for tape and reel quantity and availability.
• Solder ball material is eutectic 63/37 SnPb.
• Daisy-chained connections are connections between I/O
• (input/output) of the component.
• BT (Bismaleimide-Triazine) substrates.
• JEDEC MS-034 standard outlines.
• Ball diameter varies (see chart).
• BGA packages should be baked at 125ºC for 24 hours prior to assembly
• to prevent delamination during the assembly process.
• Moisture sensitivity is JEDEC level 3.
• Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
• Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for SnAg availability)
• PBGA‘s are not available without solder balls.