Practical Components
dummy components, tools and kits
PBGA
Plastic Ball Grid Array
Ball Grid Array
Quick Link to: PBGA Component Drawings
Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs are designed for low inductance, improved thermal operation and enhanced SMT-ability.
All PBGAs listed on this page are daisy-chained and available lead-free.
Quick Link to: PBGA Solder Information
- Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- All components are daisy-chained.
- Daisy-chained connections are connections between I/O (input/output) of the component.
- BT (Bismaleimide-Triazine) substrates.
- JEDEC MS-034 standard outlines.
- Ball diameter varies (see chart).
- BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
- Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also available.
- Sn3.5Ag also available (call for availability).
- PBGA's are not available without solder balls.
Practical does not guarantee the chain of custody for moisture sensitivity. This is due to the factory making consolidated shipments and customers quantity being met (breaking full trays quantities).
- * = DC available
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- Daisy-chained connections are connections between I/O
- (input/output) of the component.
- BT (Bismaleimide-Triazine) substrates.
- JEDEC MS-034 standard outlines.
- Ball diameter varies (see chart).
- BGA packages should be baked at 125ºC for 24 hours prior to assembly
- to prevent delamination during the assembly process.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5%
- Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for SnAg availability)
- PBGA‘s are not available without solder balls.
