Practical Components
dummy components, tools and kits
MLF®
MicroLeadFrame®
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See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
Amkor’s MicroLeadFrame® Package (MLF) is a near CSP plastic package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor’sExposedPad™ technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB.
Quick Link to: MLF Test Board and Kit
Notes:
- Two MLF® designs are available: Punch or Saw (see the cross-section drawing).
- Pin counts and body sizes change on an ongoing basis. Please call for updated listing of available packages.
- Body sizes ranging from 3 x 3mm to 12 x 12mm.
- Eutectic solder plating is 85/15 Sn/Pb.
- MLF® package is a near CSP plastic encapsulated package with a copper leadframe substrate.
- Parts are packaged in tubes.
- Parts are available in trays or on tape and reel upon special request.
- Small size (50% space reduction as compared with TSSOP).
- MLF®s are available daisy-chained (please call for more details).
- Lead-free parts are available with 100% Matte Sn. Add “Sn” to end of part number when ordering Lead-Free arts.
- Moisture sensitivity level is JEDEC 1.
- 0.6mm to 1.5mm maximum height
- MLF® is also known as QFN, MCC or MLP.
For kits see pcb007, pcb008, pc015 or pcb031
