Practical Components
dummy components, tools and kits
MLF®
MicroLeadFrame®
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See our illustrated design guide/catalog for an extensive list of dummy components, SMD production tools and equipment, PCB practice kits and other products designed to save you money and improve your process.
Quick Link to: MLF Component Drawings
Amkor’s MicroLeadFrame® Package (MLF) is a near CSP plastic package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor’sExposedPad™ technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB.
Quick Link to: MLF Test Board and Kit
Notes:
- Parts are packaged in tubes (standard).
- Parts are available in trays or on tape and reel upon special request.
- Solder plating finishes available are 85/15 SnPb and 100% Matte Sn.
- Moisture sensitivity level is JEDEC 1.
- Two MLF® designs are available: Punch or Saw (see the cross-section drawing).
- Small size (50% space reduction as compared with TSSOP).
- MLF® package is a near CSP plastic encapsulated package with a copper leadframe substrate.
- MLF® is also known as QFN, MCC or MLP.
- 0.6mm to 1.5mm maximum height
- Body sizes ranging from 3 x 3mm to 12 x 12mm.
- Pin counts and body sizes change on an ongoing basis.
Please call for updated listing of available packages.
