Practical Components

Quick Link to: FusionQuad® Component Drawings

Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the e!ective integration of ExposedPad™ QFP and MLF® technologies. FusionQuad® is based upon the addition of exposed bottom lands within a standard VQFP package format. The novel integration of bottom lands provides a cost-e!ective platform for increased lead count in a small form factor. FusionQuad® not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50% reduction in package size for a given leadcount. Additionally, FusionQuad® provides excellent RF electrical performance characteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle.

Amkor’s FusionQuad® provides an ideal package format for most IC semiconductor technologies including advanced mixed signal SoCs, motor drivers, MCUs, ASICs, DSPs and a variety of others. FusionQuad® is particularly well suited for applications requiring superior electrical or thermal performance in a cost constrained environment including hard disk drives, laptop PCs, Ethernet communication, digital television, data conversion and many others.