Practical Components
dummy components, tools and kits
etCSP™
Extremely Thin CSP™
Amkor’s Extremely Thin CSP™ (etCSP™) package is the first ball grid array capable of an extremely thin 0.5mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. etCSP™ package is constructed using conventional IC processing including standard wire bonding, molding and substrate infrastructure. The resulting package consists of one or two peripheral rows of 0.3mm diameter solder balls to allow common SMT processing. Every other aspect of the package, die, wires and moldcap are within the dimensions of the substrate and solderballs. etCSP™ design has superior moisture resistance.
Quick Link to: etCSP Drawings
| ePad Exposed Pad TSSOP | |||||||
|---|---|---|---|---|---|---|---|
| Part Number | Number of Pins |
Body Width |
Pitch | Tape Width |
Tape Pitch |
Quantity Per Tube |
Qty Per Reel |
| A-ePadTSSOP8T-4.4mm | 8 | 4.4mm | .65mm | 12/16mm | 8mm | 100 | 1,000/2,500 |
| A-ePadTSSOP14T-4.4mm | 14 | 4.4mm | .65mm | 12/16mm | 8mm | 96 | 1,000/2,500 |
| A-ePadTSSOP16T-4.4mm | 16 | 4.4mm | .65mm | 12/16mm | 8mm | 96 | 1,000/2,500 |
| A-ePadTSSOP20T-4.4mm | 20 | 4.4mm | .65mm | 16mm | 8/12mm | 74 | 1,000/2,500 |
| A-ePadTSSOP28T-4.4mm | 28 | 4.4mm | .65mm | 16mm | 8/12mm | 50 | 1,000/2,500 |
| A-ePadTSSOP28T-6.1mm | 28 | 6.1mm | .65mm | 24mm | 12mm | 50 | 1,000 |
| A-ePadTSSOP56T-6.1mm | 56 | 6.1mm | .50mm | 24mm | 12mm | 35 | 1,000 |
- Die thickness (max) is 150µm.
- Mounted height is 0.5mm.
- Die attach adhesive not required.
- Low loop wire bonding (standard).
- Package substrate is thin core FR5 or equivalent.
- Au wire is 20/25µm diameter.
- Solder balls are 0.3mm diameter / Eutectic Sn/Pb.
- Standardized footprints is 0.5mm pitch.
- Top coating (conductive epoxy) is an option.
- Moisture sensitivity is JEDEC level 1 @ 260°C.
- Lead-free is available.
- Parts are packaged in JEDEC trays.
