Practical Components
dummy components, tools and kits
ePadT TSSOP
ExposedPad™ Thin Shrink Small Outline Pkg.
Small Outline
- SOIC/SOJ Small Outline Integrated Circuit
- HSOP Heat Slug Automotive Power Pkg
- TSSOP Thin Shrink Small Outline Pkg—Amkor
- SSOP Small Shrink Outline Pkg—Amkor
- TSOP Thin Small Outline Pkg
- PLCC Plastic Leaded Chip Carrier
ExposedPad™ TSSOP IC packages significantly increase the thermal efficiency of power constrained standard TSSOP packages, which can increase heat dissipation by as much as 150%.
| ePad Exposed Pad TSSOP | |||||||
|---|---|---|---|---|---|---|---|
| Part Number | Number of Pins |
Body Width |
Pitch | Tape Width |
Tape Pitch |
Quantity Per Tube |
Qty Per Reel |
| A-ePadTSSOP8T-4.4mm | 8 | 4.4mm | .65mm | 12/16mm | 8mm | 100 | 1,000/2,500 |
| A-ePadTSSOP14T-4.4mm | 14 | 4.4mm | .65mm | 12/16mm | 8mm | 96 | 1,000/2,500 |
| A-ePadTSSOP16T-4.4mm | 16 | 4.4mm | .65mm | 12/16mm | 8mm | 96 | 1,000/2,500 |
| A-ePadTSSOP20T-4.4mm | 20 | 4.4mm | .65mm | 16mm | 8/12mm | 74 | 1,000/2,500 |
| A-ePadTSSOP28T-4.4mm | 28 | 4.4mm | .65mm | 16mm | 8/12mm | 50 | 1,000/2,500 |
| A-ePadTSSOP28T-6.1mm | 28 | 6.1mm | .65mm | 24mm | 12mm | 50 | 1,000 |
| A-ePadTSSOP56T-6.1mm | 56 | 6.1mm | .50mm | 24mm | 12mm | 35 | 1,000 |
- Solder plated exposed metal die pad.
- Highly conductive copper leadframe.
- Up to 60% improvement in Theta JA (compared to standard TSSOP).
- Standard body thickness is 0.90mm.
- Overall height is 1.1mm.
- Tube quantity may vary.
- Tape type is plastic.
