Practical Components
dummy components, tools and kits
CVBGA
Very Thin ChipArray® BGA
Ball Grid Array
ChipArray® (CVBGA) is a new package offering by Amkor that has a 0.4mm pitch. In addition to the standard core ChipArray® package (CABGA and CTBGA), Amkor offers thinner mold cap thickness of 1.0mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/O’s in a given footprint. Due to their small size and I/O density, Amkor’s ChipArray® product family is an excellent choice for new devices requiring a small footprint and low mounted height.
For more information see Amkor's parts index: www.amkor.com/products/parts/index.cfm
- Parts are packaged in JEDEC trays.
- All components are daisy-chained.
- Moisture sensitivity is JEDEC level 3.
- Solder ball material is available with Eutectic 63/37 SnPb.
- Lead-free parts are available with 95.5% Sn/ 4.0% Ag/ 0.5% Cu (SAC405) alloy or 96.5% Sn/ 3.0% Ag/ 0.5% Cu (SAC305).
- New: CVBGA parts are available without solder ball, which makes the package LGA. Please call for more details.
For kits see PCB008 and PCB011
