Practical Components

ChipArray^® Thin Core BGA

Ball Grid Array

• CVBGA Very Thin Chip Array® BGA —Amkor
• CABGA Chip Array® BGA —Amkor
• TapeArray® BGA—Amkor
• CTBGA ChipArray® Thin Core Ball Grid Array —Amkor
• PBGA Plastic Ball Grid Array —Amkor
• PBGA Plastic Ball Grid Array Pitch
• SuperBGA®—Amkor

Notes:

• Parts are packaged in JEDEC trays when available.
• All components are available daisy-chained.
• <0.12mm (5 mil) coplanarity.
• Solder ball material is Eutectic 63/37 SnPb.
• BT (Bismaleimide-Triazine) substrates or equivalent.
• Package thickness is 1.2mm max for 0.8mm and 1.0mm pitch packages.
• Package thickness is 1.1mm max for 0.5mm pitch packages.
• Moisture sensitivity is JEDEC level 3.
• Lead-free parts are available with (SAC405) 95.5% Sn/4.0% Ag/0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.25%Sn/1.2%Ag/0.5%Cu/.05%Ni is also available.
• New: CABGA, CVBGA and CTBGA parts are available without solder balls, which makes the package LGA.