Practical Components
dummy components, tools and kits
CABGA
ChipArray® BGA
Ball Grid Array
Quick Link to: CABGA Component Drawings
ChipArray® (CABGA) packages are offered in laminate format and are available as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts. Established SMT mounting processes and techniques are compatibly with ChipArray®. The package size and design provides ideal RF operation (low inductance) for high speed applications requiring small footprints.
For more information see Amkor TechnologyAmkor ChipArray® Data Sheet
For recommended kits see PC009-40, PCB009, PC015 and PCB031
- Parts are packaged in JEDEC trays when available.
- All components are available daisy-chained.
- <0.12mm (5 mil) coplanarity.
- Solder ball material is Eutectic 63/37 SnPb.
- BT (Bismaleimide-Triazine) substrates or equivalent.
- Package thickness is 1.5mm max for 0.8mm and 1.0mm pitch packages.
- Package thickness is 1.34mm max for 0.5mm pitch packages.
- Moisture sensitivity is JEDEC level 3.
- Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu
- alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.25%Sn/
- 1.2%Ag/0.5%Cu/.05%Ni is also available.
- New: CABGA, CVBGA and CTBGA parts are available without solder balls, which makes the package LGA.
