Solder Test/Process Evaluation PCB Boards and Kits
The PACTECH Flip Chip Test & Evaluation board is for placement and daisy chain continuity testing after assembly. Substrate has 14 mounting sites for 10 x 10mm Flip Chips.
FA10 laminate test board for the 10mil pitch flip chip. Board finish is Organic Solderability Preservative (OSP).
PB08 test board for process evaluation and qualification of the PB-08 2x2 flip chip component.
The Practical Components PCB368-8 Evaluation Board is a test vehicle for the .3mm fine pitch CVBGA component.
Practical Components new TMV® 14MM test board and kit is a basic drop test board designed for the Amkor TMV® (Through Mold Via) components.
This PoP 12mm Board and Kit is designed as test vehicle for the new Amkor (PSvfBGA) 12x12 305 PoP package. PoP packages from Amkor focus on high density logic devices.
This PoP 12mm Board and Kit is designed as test vehicle for the Amkor (PSvfBGA) 14x14 305 PoP package. PoP packages from Amkor focus on high density logic devices.
Practical Components has developed a full range of machine run PCB boards used for setup, evaluation, assembly workflow evaluation, soldering programing, profiling, practice and certification, soldering rework training, prototyping, capability demonstrations, testing, CPK studies and more.
Practical Components provides products and services for the testing and evaluation of Conformal Coating materials on assembled PCB test boards.
The Practical Components B-52 CRET (Cleanliness & Residue Evaluation Test) board is designed to help determine the ionic cleanliness of a customers manufacturing process. Solder practice test vehicle PCB boards and kits are used for machine setup, evaluation, qualification, workflow analysis, proto...
The Practical SIR board is double sided board to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test is carried out at height humidity and heat conditions. The board contains pa...
Tin-Lead or Lead-Free Available! The SMTA Saber Evaluation Kit. Practical Components is licensed by SMTA to distribute the Saber Evaluation PC Board. The Saber Board includes land patterns for a wide variety of JEDEC and EIAJ components.
he PCB-B-36 standard test board was designed for the IPC cleaning cleanliness test program, Phase 1. It was designed for examining the ability of a cleaning solvent to remove flux residues, and to examine the effects of entrapped residues under low standoff components.
The PCB-B-25A test board meets the current guidelines for solder Masks (IPC-SM-804C) and conformal coatings (IPC-CC-830A).
The PCB-B-24 standard test board is compliant with the IPC Phase 3 cleaning and cleanliness test program. It was designed to be a vehicle for examining the interactions between laminate, surface metalizations, and fluxes. It is the primary qualification vehicle for ANSI J-STD-004, which is the IPC s...
he New Practical Components B-52 CRET (Cleanliness & Residue Evaluation Test) Kit is designed to help determine the ionic cleanliness of a customers manufacturing process. The test boards and components follow guidelines associated with the IPC-B-52 Test Vehicle.
B-52 CRET Rev B Cleanliness and Residue Evaluation Test Kit is the newest revision of the existing B-52 CRET board.
The PCB000 test board has land patterns for 01005, 0201, 0402, and 0603 Zero Ohm Lead-Free SMD Resistors. Each component pad is connected in series (daisy-chained) to the next pad.
The AIM print test board was designed to include many printing challenges which are commonly encountered on manufacturers assemblies. BGA pads have circular and square pad design to test paste release. AIM has included the standard IPC slump test pattern in order to further challenge the properties ...
Practical Components is now offering a “one-of-a-kind” BGA Variable Pitch and Array PC Board. Each board contains matrices for the most popular ball pitches found on BGAs and CSPs.
This PCB007 MicroLeadFrame® (MLF®) Test Board is two test boards in one. The top side of the board consists of daisy-chained MLF® pads. Amkor’s new MLF® packages are a near CSP plastic encapsulated
Rework practice, solder training and evaluation, and for testing and calibration of pick-and-place machines.
The PC009 Mixed Technology kit has surface mount components and through-hole components. This kit’s primary use is for hand soldering but is also available as machine run upon special request.
The PC011 BGA Kit contains Amkor daisy-chained fine pitch BGAs. The daisy-chain PCB011 test board contains patterns for the 0.4mm pitch, 0.5mm pitch and 1.0mm pitch CSP/BGA components.
The New PCB012 Global Daisy-Chain test board has 25 different BGA land patterns. Board pads accommodate BGA components ranging from 15mm square to 35mm square.
IPC-9850 includes test methods for determining various SMT placement equipment attributes, including repeatability, accuracy and attribute defects.
Practical Components and Cookson Electronics are teaming up to offer a new Lead-Free Process Capability Validation Program. This program consists of lead-free components and test boards from Practical Components
Practical Components and Aegis Industrial Software, the leader in Manufacturing?Information Management Systems, have partnered together to offer a traceability and control kit designed to validate your entire manufacturing process and provide the potential for rich product and process traceability d...
Practical Components has worked with Jabil to develop a new Solder Paste evaluation and qualification board and kit. The Jabil Solder Paste Evaluation These kits were designed primarily for solder paste evaluations but can be used for a wide variety of requirements as well as for development of new...
Indium Corporation SMT/PTH Mixed Technology Pb-Free Kit Practical Components and Indium Corporation are introducing a new Lead-Free SMT/Through-hole Mixed Technology test board and kit. The PCB049 Board can be used to evaluate the following conditions:
The new FusionQuad® 216 ld (100/116) drop test evaluation kit contains both the test board and Amkor FusionQuad® 216 components.
Thermal Cycling test PCB board and kit for Amkor’s FusionQuad® components. Thermal Cycling is a diagnostic test for electronic assemblies. The test is severe on solder joints that are under both compressive and tensile strain during cycling as a result of differential thermal expansion.
The 15mm Package on Package (PoP) Thermal Cycling Test Board is designed for use with Amkor’s new 15mm PoP components. Both top and Bottom components can be mounted on the board and connected with a daisy chain pattern to the test board.