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CQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 28 to 240, with lead pitch ranging from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.
CQFP Ceramic Quad Flat Pack |
||||
Part Description |
Number |
Body Size |
Pitch |
|
(Inch) |
(mm) |
|||
52CQFP-19.0mm-1.27mm |
52 |
.750" sq |
19.0mm sq |
1.27mm |
68CQFP-24.1mm-1.27mm |
68 |
.950" sq |
24.1mm sq |
1.27mm |
84CQFP-16.5mm-.65mm |
84 |
.650" sq |
16.5mm sq |
.65mm |
100CQFP-19.0mm-.65mm |
100 |
.750" sq |
19.0mm sq |
.65mm |
132CQFP-24.1mm-.65mm |
132 |
.950" sq |
24.1mm sq |
.65mm |
144CQFP-26.6mm-.65mm |
144 |
1.050" sq |
26.6mm sq |
.65mm |
172CQFP-29.2mm-.65mm |
172 |
1.150" sq |
29.2mm sq |
.65mm |
196CQFP-32.0mm-.50mm |
196 |
1.260" sq |
32.0mm sq |
.50mm |
Notes
* CQFPs are available with or without combo lid.
* Pins are flat (sandwiched) with tie bar.
* Parts are packaged in non-JEDEC trays.
* Due to the custom nature of the package, body size and dimensions can change without notice.
* Parts available with a daisy-chain configuration upon request.
* Other ceramic packages available upon request.
* Glass or epoxy seal.
* Footprint compatible with plastic QFP packages.
* EIAJ and JEDEC standards.
* Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.
Part Description System
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